Design and development of compact spiral ribbed cooling unit for electronic chipsets with high power densities

Shyy-Woei Chang, Chiang Kuei Feng, Wang Huiru, Huang Chuan Chin, Kao Juei Ken

研究成果: Conference contribution

摘要

This paper presents the results of a set of numerical and experimental studies for flow and heat transfer in a spiral channel roughened by skew ribs over two opposite endwalls. The experimental Nusselt number (Nu) distributions, pressure drop coefficients (f) and thermal performance factors (η) for the spiral ribbed channel are examined along with the flow structures determined from the CFD analysis. The comparisons of Heat Transfer Enhancement (HTE) ratios measured from the ribbed spiral channel with other passive types of HTE devices confirm the favorable HTE performances for the spiral channel with the in-line skew ribs. A subsequent design and product development for the liquid cooling unit using the ribbed spiral channel is described with the pressure drops and thermal resistances presented. This study confirms the availability of the enhanced liquid cooling performance using the spiral ribbed channel for the electronic chipset(s) with higher power densities.

原文English
主出版物標題27th Annual IEEE Semiconductor Thermal Measurement and Management, SEMI-THERM 27 2011
頁面231-238
頁數8
DOIs
出版狀態Published - 2011 六月 2
事件27th Annual IEEE Semiconductor Thermal Measurement and Management, SEMI-THERM 27 2011 - San Jose, CA, United States
持續時間: 2011 三月 202011 三月 24

出版系列

名字Annual IEEE Semiconductor Thermal Measurement and Management Symposium
ISSN(列印)1065-2221

Other

Other27th Annual IEEE Semiconductor Thermal Measurement and Management, SEMI-THERM 27 2011
國家United States
城市San Jose, CA
期間11-03-2011-03-24

    指紋

All Science Journal Classification (ASJC) codes

  • Instrumentation
  • Electrical and Electronic Engineering

引用此

Chang, S-W., Feng, C. K., Huiru, W., Chin, H. C., & Ken, K. J. (2011). Design and development of compact spiral ribbed cooling unit for electronic chipsets with high power densities. 於 27th Annual IEEE Semiconductor Thermal Measurement and Management, SEMI-THERM 27 2011 (頁 231-238). [5767206] (Annual IEEE Semiconductor Thermal Measurement and Management Symposium). https://doi.org/10.1109/STHERM.2011.5767206