TY - JOUR
T1 - Design and fabrication of an IC encapsulation mold adhesion force tester
AU - Chang, Shyang Jye
AU - Hwang, Sheng Jye
N1 - Funding Information:
Manuscript received June 29, 2002; revised August 15, 2003. This work was supported in part by Metal Industries Research and Development Center, Kaoh-siung, Taiwan. The authors are with the Department of Mechanical Engineering, National Cheng Kung University, Tainan, Taiwan R.O.C. (e-mail: puppy.tw@yahoo. com.tw; [email protected]). Digital Object Identifier 10.1109/TEPM.2003.820821
PY - 2003/10
Y1 - 2003/10
N2 - In integrated circuit (IC) packaging, when epoxy molding compound (EMC) is filling the mold cavity and cured in the mold, adhesion occurs in the interface between EMC and mold surface. Too large an adhesion force can damage an IC and lower the yield rate. However, there was no report showing how to measure the mold adhesion force. This paper described the design and fabrication of an automatic EMC adhesion force test instrument that will measure adhesion force between mold surface and EMC. By measuring the adhesion force, one can judge how much does a specific type of surface treatment help in reducing the amount of mold adhesion force. One can also use this instrument to determine what parameters are important for reducing the magnitude of adhesion force between EMC and mold surface.
AB - In integrated circuit (IC) packaging, when epoxy molding compound (EMC) is filling the mold cavity and cured in the mold, adhesion occurs in the interface between EMC and mold surface. Too large an adhesion force can damage an IC and lower the yield rate. However, there was no report showing how to measure the mold adhesion force. This paper described the design and fabrication of an automatic EMC adhesion force test instrument that will measure adhesion force between mold surface and EMC. By measuring the adhesion force, one can judge how much does a specific type of surface treatment help in reducing the amount of mold adhesion force. One can also use this instrument to determine what parameters are important for reducing the magnitude of adhesion force between EMC and mold surface.
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U2 - 10.1109/TEPM.2003.820821
DO - 10.1109/TEPM.2003.820821
M3 - Article
AN - SCOPUS:1242263835
SN - 1521-334X
VL - 26
SP - 281
EP - 285
JO - IEEE Transactions on Electronics Packaging Manufacturing
JF - IEEE Transactions on Electronics Packaging Manufacturing
IS - 4
ER -