This work is concerned with the development of micro metallic alloy strain gages made of nickel and copper for mechanical strain measurement. The magnetron sputtering technique is adopted to deposit the metallic Ni-Cu alloy film to the surface of silicon wafer and flexible polyimide substrate. Similar fabrication process has also been applied to co-sputter the micro Ni-Cu alloy strain gages on the surface of silicon wafer. It is reported that the deposition of the metallic alloy sensors on silicon wafer coated with an insulation layer can be used as a strain sensor and the X-ray diffraction examination reports that FCC microstructure is obtained and reasonably good electric resistivity is found. The line width of the current micro metallic strain gage is designed to be 30 μm and the width and length of the micro strain gage is set to be 390 Jim and 750 μm. The current microfabricated Ni-Cu strain gage is reported to be in the range of 320-350 Ω. It was reported that the current sputtered micro Ni-Cu strain gage can closely measure the structural bending strain. In addition, the impact strain measurement has also been conducted and the present developed micro strain sensor seems able to detect the dynamic mechanical response also.
|期刊||International SAMPE Symposium and Exhibition (Proceedings)|
|出版狀態||Published - 2006 十二月 1|
|事件||SAMPE '06: Creating New Opportunities For The World Economy - Long Beach, CA, United States|
持續時間: 2006 四月 30 → 2006 五月 4
All Science Journal Classification (ASJC) codes