Design and test of additive manufacturing for coating thermoplastic PEEK material

C. Y. Liu, Y. W. Hsieh, T. J. Sun, J. W. Zeng, A. B. Wang, N. T. Lee, S. W. Chau, W. C. Wei, Bernard Haochih Liu, R. C. Luo

研究成果: Conference contribution

7 引文 斯高帕斯(Scopus)

摘要

3D printing, also known as additive manufacturing, has been considered as the next big thing that can potentially spread as cell phone industry. Nowadays, product resolution restricted by material and fabrication process is ranging from 20 to 300 pm and still has the trends toward higher precision. However, tradeoff between time costs and resolution is always a dilemma in Fused Deposition Modeling (FDM) technique. In contrast, the idea of Laminated Object Manufacturing (LOM) has been applied for rapid prototyping recently. In this work, based on the concept of bond-then-cut, a light and ultra-thin slot die coater has been developed to generate thin and uniform layer of thermoplastic Polyether ether ketone (PEEK) material. By utilizing the suitable flow channel geometry through numerical simulation, PEEK's affinity with substrate, and coating window establishment, we produced 600 mm2 PEEK film with thickness low to 50 pm within a minute, which greatly enhance the manufacturing efficiency. In addition, 10 layered film with 1 mm in thickness has been demonstrated. The success in fabricating PEEK film by the novel design shows its good potential and applicability in additive manufacturing.

原文English
主出版物標題Proceedings - 2016 IEEE International Conference on Industrial Technology, ICIT 2016
發行者Institute of Electrical and Electronics Engineers Inc.
頁面1158-1162
頁數5
ISBN(電子)9781467380751
DOIs
出版狀態Published - 2016 5月 19
事件IEEE International Conference on Industrial Technology, ICIT 2016 - Taipei, Taiwan
持續時間: 2016 3月 142016 3月 17

出版系列

名字Proceedings of the IEEE International Conference on Industrial Technology
2016-May

Other

OtherIEEE International Conference on Industrial Technology, ICIT 2016
國家/地區Taiwan
城市Taipei
期間16-03-1416-03-17

All Science Journal Classification (ASJC) codes

  • 電腦科學應用
  • 電氣與電子工程

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