Design of a rectangular DC magnetron sputtering system with controllable target erosion patterns

Cheng Tsung Liu, Hsiao Chun Yeh, Chih-Wen Chang

研究成果: Conference contribution

1 引文 斯高帕斯(Scopus)

摘要

To supply higher deposition rate and better target utilization, simple and cost-effective adjustments that can be applied to the existing DC magnetron sputtering systems are desired. By attaching adequate iron annulus and compensation magnetizations, electron trajectories near the target surface can be confined and the target erosion patterns can then be properly controlled. Hence, the target can be more effectively utilized and the substrate deposition rate can also be indirectly enhanced. Three typical patterns have been selected and promising results have showed that the erosion patterns on the targets can be precisely controlled to the designated reference profiles with resemblances higher than 98.78%, along with the substrate sputtering rate enhancements in the range of 20.87%-23.06%. From such verifications, clearly the refinement concepts for better the system performance can be confirmed.

原文English
主出版物標題2011 International Conference on Electrical Machines and Systems, ICEMS 2011
DOIs
出版狀態Published - 2011 十二月 16
事件2011 International Conference on Electrical Machines and Systems, ICEMS 2011 - Beijing, China
持續時間: 2011 八月 202011 八月 23

出版系列

名字2011 International Conference on Electrical Machines and Systems, ICEMS 2011

Other

Other2011 International Conference on Electrical Machines and Systems, ICEMS 2011
國家/地區China
城市Beijing
期間11-08-2011-08-23

All Science Journal Classification (ASJC) codes

  • 電氣與電子工程
  • 機械工業

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