Design of ultra-compact 60-GHz millimeter-wave CMOS on-chip bandpass filter with two controllable transmission zeros

Yu Chen Chen, Lung Kai Yeh, Huey Ru Chuang

研究成果: Conference contribution

2 引文 斯高帕斯(Scopus)

摘要

An ultra-compact 60-GHz millimeter-wave on-chip bandpass filter (BPF) is proposed and fabricated with 18-μm standard CMOS process. The design method helps achieve not only efficient size reduction but also two controllable transmission zeros located on both sides of the passband. One transmission zero is produced by a coupled line structure, whereas the other one is produced owing to the appearance of a parasitic inductor. Therefore, the proposed BPF can obtain a better cutoff rate in the edges of the passband and provide much improved skirt selectivity. The entire chip size of the proposed filter is 0.182 × 0.566 mm2, and the core size is 0.062 × 0.556 mm2. The proposed filter with a center frequency of 60 GHz has an insertion loss of less than 3.5-dB. A good agreement between the simulation and measurement results is observed.

原文English
主出版物標題2014 Asia-Pacific Microwave Conference Proceedings, APMC 2014
發行者Institute of Electrical and Electronics Engineers Inc.
頁面935-937
頁數3
ISBN(電子)9784902339314
出版狀態Published - 2014 三月 25
事件2014 Asia-Pacific Microwave Conference, APMC 2014 - Sendai, Japan
持續時間: 2014 十一月 42014 十一月 7

出版系列

名字2014 Asia-Pacific Microwave Conference Proceedings, APMC 2014

Other

Other2014 Asia-Pacific Microwave Conference, APMC 2014
國家Japan
城市Sendai
期間14-11-0414-11-07

All Science Journal Classification (ASJC) codes

  • Computer Networks and Communications
  • Hardware and Architecture
  • Electrical and Electronic Engineering

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    Chen, Y. C., Yeh, L. K., & Chuang, H. R. (2014). Design of ultra-compact 60-GHz millimeter-wave CMOS on-chip bandpass filter with two controllable transmission zeros. 於 2014 Asia-Pacific Microwave Conference Proceedings, APMC 2014 (頁 935-937). [7067583] (2014 Asia-Pacific Microwave Conference Proceedings, APMC 2014). Institute of Electrical and Electronics Engineers Inc..