Design optimization for wafer level package by using sequential optimization and reliability assessment method

Jung Chuan Chien, Tz-Cheng Chiu

研究成果: Conference contribution

摘要

A reliability-based design optimization (RBDO) procedure that incorporates sequential optimization and reliability assessment (SORA) algorithm with numerical finite element (FE) simulations is developed for performing interconnect reliability based multi-objective design optimization for a wafer level package (WLP). In this procedure, the board-level temperature cycling (T/C) reliability associated to the fatigue cracking of the solder joints and redistribution layer (RDL) Cu traces is considered as the objective of the design optimization. Effects of uncertainties in geometry tolerances and fatigue life distributions are also considered. Optimizations of the WLP interconnect geometries including RDL Cu pad diameter, pad opening diameter and polymer dielectric thickness were conducted with either minimizing the fatigue damage parameters or maximizing the first-fail life as the objective. It was found that the multi-objective optimization process using the damage parameters associated to individual failure modes may result in target geometries different from the optimization for the failure life.

原文English
主出版物標題11th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2016 - Proceedings
發行者IEEE Computer Society
頁面184-187
頁數4
ISBN(電子)9781509047697
DOIs
出版狀態Published - 2016 十二月 27
事件11th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2016 - Taipei, Taiwan
持續時間: 2016 十月 262016 十月 28

出版系列

名字Proceedings of Technical Papers - International Microsystems, Packaging, Assembly, and Circuits Technology Conference, IMPACT
ISSN(列印)2150-5934
ISSN(電子)2150-5942

Other

Other11th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2016
國家/地區Taiwan
城市Taipei
期間16-10-2616-10-28

All Science Journal Classification (ASJC) codes

  • 硬體和架構
  • 控制與系統工程
  • 電氣與電子工程

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