Design optimization for wafer level package by using sequential optimization and reliability assessment method

Keyphrases

• Optimization Assessment 100%
• Reliability Assessment Method 100%
• Redistribution Layer 66%
• Assessment Algorithm 33%
• Multi-objective Design Optimization 33%
• Package Interconnect 33%
• Numerical Finite Element Simulation 33%
• Fatigue Life Distribution 33%
• Fatigue Damage Parameter 33%
• Reliability-based Design Optimization 33%
• Damage Parameter 33%

Engineering

• Reliability Assessment Method 100%
• Fatigue Damage Parameter 33%
• Damage Parameter 33%
• Reliability Based Design 33%
• Design Optimisation Procedure 33%
• Based Design Optimization 33%