Detailed elastic analysis of the flat punch (tack) test for pressure-sensitive adhesives

Y. Y. Lin, C. Y. Hui, H. D. Conway

研究成果: Article同行評審

58 引文 斯高帕斯(Scopus)

摘要

Detailed finite element calculations are carried out in order to study the mechanical response of a compliant layer sandwiched between a rigid cylindrical flat punch and a rigid substrate. Two cases of practical interest are considered: one in which the layer is perfectly bonded to the punch and the substrate and one in which the interface between the punch and the layer is frictionless. The substrate is assumed to be perfectly bonded to the adhesive layer in both cases. Analytic expressions are obtained for the stresses away from the edges, and the effect of lateral constraint is examined. The compliances of the loading systems for both cases are obtained numerically, and accurate analytic expressions are determined based on these numeric results. The nature of the stress fields near the contact edge are explored, and their connections with the energy release rate are determined. The relevance of these calculations to two recent adhesion tests is discussed.

原文English
頁(從 - 到)2769-2784
頁數16
期刊Journal of Polymer Science, Part B: Polymer Physics
38
發行號21
DOIs
出版狀態Published - 2000 十一月 1

All Science Journal Classification (ASJC) codes

  • Condensed Matter Physics
  • Physical and Theoretical Chemistry
  • Polymers and Plastics
  • Materials Chemistry

指紋 深入研究「Detailed elastic analysis of the flat punch (tack) test for pressure-sensitive adhesives」主題。共同形成了獨特的指紋。

引用此