Development and Validation of a Semi-Analytical Model for Predicting Asymmetric Warpage of Fan-Out Reconstituting Packaging

Yu Chin Lee, Chia Yu Chen, Yi Sheng Chen, Kuo Shen Chen, Tang Yuan Chen, Dao Lung Chen, David Tarng

研究成果: Conference contribution

2 引文 斯高帕斯(Scopus)

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Engineering & Materials Science