Development of a consistent multiaxial viscoelastic model for package warpage simulation

Tz-Cheng Chiu, Dong Yi Huang, Bo Sheng Lee, Dao Long Chen, Ping Feng Yang, Chin Li Kao

研究成果: Conference contribution

7 引文 斯高帕斯(Scopus)

摘要

A procedure for constructing the three-dimensional viscoelastic constitutive model of polymeric packaging material over a wide range of temperatures is presented. By using both tensile and torsional dynamic mechanical analyses (DMA) and thermal mechanical analyses (TMA), the viscoelastic constitutive behavior of a low-filler-percentage epoxy molding compound (EMC) was first characterized. Storage modulus mastercurves obtained from the DMA were converted to the relaxation moduli in the Laplace-Carson transform domain. The transformed Young's and shear relaxation moduli were then curve fitted by using an optimization procedure with restriction for ensuring physically admissible time-dependent Poisson's ratio. Bulk and shear relaxation moduli were then obtained from the fitted moduli and inverse transformed to the time domain. A numerical finite element model that considers the viscoelastic constitutive behavior of EMC was applied to simulate warpage of an overmolded flip-chip package under the surface mount solder reflow process and compared to experimental shadow Moiré measurements for validating the constitutive model.

原文English
主出版物標題2015 IEEE 65th Electronic Components and Technology Conference, ECTC 2015
發行者Institute of Electrical and Electronics Engineers Inc.
頁面373-379
頁數7
ISBN(電子)9781479986095
DOIs
出版狀態Published - 2015 七月 15
事件2015 65th IEEE Electronic Components and Technology Conference, ECTC 2015 - San Diego, United States
持續時間: 2015 五月 262015 五月 29

出版系列

名字Proceedings - Electronic Components and Technology Conference
2015-July
ISSN(列印)0569-5503

Other

Other2015 65th IEEE Electronic Components and Technology Conference, ECTC 2015
國家/地區United States
城市San Diego
期間15-05-2615-05-29

All Science Journal Classification (ASJC) codes

  • 電子、光磁材料
  • 電氣與電子工程

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