Development of a microelectromechanical system pressure sensor for rehabilitation engineering applications

Based on computer finite-element analysis ANSYS 5.3 and microelectromechanical systems (MEMS) technologies, a micropressure sensor was designed and fabricated. The sensor can be used to measure the distribution of normal stress between soft tissues on an above-knee amputee'S skin and the contacting surface of a rehabilitation device. A square membrane with dimensions 2400μm × 2400μm × 80μm is formed by backside photolithography and wet etching of an n-type 〈100〉 monolithic silicon wafer. On the middle of the membrane edge, an X-shaped silicon wafer was implanted with boron ions and then enhanced by diffusion to form a piezoresistive strain gauge. In the design process, a finite-element method is used to analyse the effects of pressure sensitivity and its temperature coefficients. The developed micropressure sensors, which have smaller weight and volume than a conventional machine type, perform well and fit our design specifications.