Development of consistent interconversions between linear viscoelastic functions for multiaxial viscoelastic models

Dao Long Chen, Tz Cheng Chiu, Shu Hua Lee, Po Hsien Sung, Meng Kai Shih, David Tarng, Chih Pin Hung

研究成果: Conference contribution

摘要

Characterizations for the comprehensive viscoelastic behaviors of materials were conducted in this research. For considering the multiaxial viscoelastic behaviors of the polymeric constituents in finite element models for package stress and deformation simulations, it is required to construct the mathematical models of the viscoelastic bulk and shear relaxation moduli. In order to obtain the consistent viscoelastic functions, the interconversion relations were developed and applied as a new fitting procedure. By using the consistently fitted values of viscoelastic bulk and shear relaxation moduli, the constitutive behaviors of organic packaging materials by using time-dependent viscoelastic models for warpage predictions could be more accurate.

原文English
主出版物標題IMPACT 2017 - 12th International Microsystems, Packaging, Assembly and Circuits Technology Conference, Proceedings
發行者IEEE Computer Society
頁面282-285
頁數4
ISBN(電子)9781538647196
DOIs
出版狀態Published - 2017 7月 1
事件12th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2017 - Taipei, Taiwan
持續時間: 2017 10月 252017 10月 27

出版系列

名字Proceedings of Technical Papers - International Microsystems, Packaging, Assembly, and Circuits Technology Conference, IMPACT
2017-October
ISSN(列印)2150-5934
ISSN(電子)2150-5942

Other

Other12th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2017
國家/地區Taiwan
城市Taipei
期間17-10-2517-10-27

All Science Journal Classification (ASJC) codes

  • 硬體和架構
  • 控制與系統工程
  • 電氣與電子工程

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