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Diagnosing Transition Delay Faults under Scan-Based Logic Array

研究成果: Conference contribution

摘要

This paper presents a novel diagnostic procedure for transition delay faults (TDFs) using a two-dimensional scan - based test chip architecture. The test chip architecture consists of C-testable blocks (CTBs) and scan registers. Each CTB has the distinguished VH-bijection property that ensures any change on either the vertical or horizontal input of a CTB will lead to changes in both vertical and horizontal outputs. The diagnostic procedure consists of two tests, one for the scan chain test and the other for the whole chip test. Experimental result s show that the required time for a test chip containing 68∗68 8-input/8-output CTBs is less than 0.2 seconds when executing the test procedure at 100MHz. The proposed diagnostic procedure can achieve 100% diagnosability for all transition faults in th e test chip.

原文English
主出版物標題Proceedings - 2022 IEEE International Test Conference in Asia, ITC-Asia 2022
發行者Institute of Electrical and Electronics Engineers Inc.
頁面13-18
頁數6
ISBN(電子)9781665455237
DOIs
出版狀態Published - 2022
事件6th IEEE International Test Conference in Asia, ITC-Asia 2022 - Taipei, Taiwan
持續時間: 2022 8月 242022 8月 26

出版系列

名字Proceedings - 2022 IEEE International Test Conference in Asia, ITC-Asia 2022

Conference

Conference6th IEEE International Test Conference in Asia, ITC-Asia 2022
國家/地區Taiwan
城市Taipei
期間22-08-2422-08-26

All Science Journal Classification (ASJC) codes

  • 硬體和架構
  • 電氣與電子工程
  • 安全、風險、可靠性和品質

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