DIC image on FIB ring-core analysis of depth sensing residual stress measurement of thin films

Wen Chieh Pan, Ang Ting Tsai, Fa Yen Cheng, Terry Yuan Fang Chen, Ming Tzer Lin

研究成果: Conference contribution

1 引文 斯高帕斯(Scopus)

摘要

This work demonstrates a technique to measure the residual stress of thin films that involves a combination of focused ion beam (FIB) milling, SEM imaging and digital image correlation (DIC) analysis. Use focused ion beam (FIB) to surface milling different depth of the ring core on thin film and capture the clear images with sub-micron resolution SEM. The residual stress measurement of 1.5 µm thick silver film through PVD Sputter and E-gun deposition was discussed. By the use of digital image correlation (DIC) for full-field strain analysis and calculate the displacement-strain relationship of the silver film surface and SEM high-resolution surface deformation images. The residual stress state of the two kinds of silver films was evaluated, which indicated that FIB-DIC was well implemented to measure the residual stress.

原文English
主出版物標題Advancement of Optical Methods and DigitalImage Correlation in Experimental Mechanics - Proceedings of the 2018 Annual Conference on Experimentaland Applied Mechanics
編輯Luciano Lamberti, Cosme Furlong, Phillip L. Reu, Ming-Tzer Lin, Cesar Sciammarella, Michael A. Sutton
發行者Springer Science and Business Media, LLC
頁面109-111
頁數3
ISBN(列印)9783319974804
DOIs
出版狀態Published - 2019
事件SEM Annual Conference and Exposition on Experimental and Applied Mechanics, 2018 - Greenville, United States
持續時間: 2018 6月 42018 6月 7

出版系列

名字Conference Proceedings of the Society for Experimental Mechanics Series
12
ISSN(列印)2191-5644
ISSN(電子)2191-5652

Conference

ConferenceSEM Annual Conference and Exposition on Experimental and Applied Mechanics, 2018
國家/地區United States
城市Greenville
期間18-06-0418-06-07

All Science Journal Classification (ASJC) codes

  • 一般工程
  • 計算力學
  • 機械工業

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