摘要
Reflow behavior of a Sn-8.5Zn-0.5Ag-0.01Al-0.1Ga (five-element) solder on the Ni/Cu substrate was investigated under different heating rates. Reflowed samples show decreased Zn and increased AgZn3 in the solder with a reduction in the heating rate. The Zn at the solder/substrate interface was found to be much lower than that in the Sn-Zn solder systems. Cu was observed to be diffused through the electroplated Ni layer and noticed only with the Ag-Zn compound in the solder. Ga was spotted at the interface in the Ag-Zn matrix, whereas Al was detected with the Zn at the interface. Small intermetallic compound (IMC) layer was formed at the interface; however, its amount enhanced with the reduction in the heating rate. Present study relates the reflow behavior of the five-element solder with the reactivity of different elements in the system and its influence on the formation of IMCs in the solder and at the solder/substrate interface.
原文 | English |
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頁(從 - 到) | 1142-1148 |
頁數 | 7 |
期刊 | Journal of Materials Research |
卷 | 27 |
發行號 | 8 |
DOIs | |
出版狀態 | Published - 2012 4月 28 |
All Science Journal Classification (ASJC) codes
- 一般材料科學
- 機械工業
- 材料力學
- 凝聚態物理學