Diffusion of Cu and interfacial reactions during reflow of Sn-8.5Zn-0.5Ag-0.01Al-0.1Ga alloy on Ni/Cu substrate

Jagjiwan Mittal, Kwang-Lung Lin

研究成果: Article同行評審

5 引文 斯高帕斯(Scopus)

摘要

Reflow behavior of a Sn-8.5Zn-0.5Ag-0.01Al-0.1Ga (five-element) solder on the Ni/Cu substrate was investigated under different heating rates. Reflowed samples show decreased Zn and increased AgZn3 in the solder with a reduction in the heating rate. The Zn at the solder/substrate interface was found to be much lower than that in the Sn-Zn solder systems. Cu was observed to be diffused through the electroplated Ni layer and noticed only with the Ag-Zn compound in the solder. Ga was spotted at the interface in the Ag-Zn matrix, whereas Al was detected with the Zn at the interface. Small intermetallic compound (IMC) layer was formed at the interface; however, its amount enhanced with the reduction in the heating rate. Present study relates the reflow behavior of the five-element solder with the reactivity of different elements in the system and its influence on the formation of IMCs in the solder and at the solder/substrate interface.

原文English
頁(從 - 到)1142-1148
頁數7
期刊Journal of Materials Research
27
發行號8
DOIs
出版狀態Published - 2012 四月 28

All Science Journal Classification (ASJC) codes

  • Materials Science(all)
  • Mechanical Engineering
  • Mechanics of Materials
  • Condensed Matter Physics

指紋 深入研究「Diffusion of Cu and interfacial reactions during reflow of Sn-8.5Zn-0.5Ag-0.01Al-0.1Ga alloy on Ni/Cu substrate」主題。共同形成了獨特的指紋。

引用此