Diffusion of Cu and interfacial reactions during reflow of Sn-8.5Zn-0.5Ag-0.01Al-0.1Ga alloy on Ni/Cu substrate

Jagjiwan Mittal, Kwang-Lung Lin

研究成果: Article同行評審

5 引文 斯高帕斯(Scopus)

指紋 深入研究「Diffusion of Cu and interfacial reactions during reflow of Sn-8.5Zn-0.5Ag-0.01Al-0.1Ga alloy on Ni/Cu substrate」主題。共同形成了獨特的指紋。

Chemical Compounds

Engineering & Materials Science

Physics & Astronomy