Diffusion of elements during reflow ageing of Sn-Zn solder in liquid state on Ni/Cu substrate – theoretical and experimental study

Engineering & Materials Science

• Soldering alloys 79%
• Aging of materials 64%
• Substrates 57%
• Liquids 54%
• Intermetallics 47%
• Melting point 19%
• X-Ray Emission Spectrometry 11%
• Temperature 7%
• Scanning electron microscopy 7%
• Chemical analysis 5%

Chemical Compounds

• Solder 100%
• Intermetallic Compound 61%
• Diffusion 49%
• Liquid 43%
• Diffusion Coefficient 20%
• Melting Point 19%
• Time 8%
• Scanning Electron Microscopy 6%
• Reduction 5%

Physics & Astronomy

• solders 90%
• intermetallics 51%
• liquids 43%
• melting points 22%
• diffusion coefficient 18%
• methodology 9%
• electron energy 8%
• scanning electron microscopy 7%
• temperature 6%
• matrices 6%
• spectroscopy 6%
• x rays 5%