@inproceedings{4f61d2ca739e43f3b0a8882c0e6f29fd,
title = "Direct Observation of Void Nucleation and Growth in a 2-μm-Wide Cu Redistribution Line During In Situ Electromigration",
abstract = "In this study, we reported direct observation of void nucleation and growth in a fan-out 2-μm-wide Cu redistribution line (RDL) embedded in polyimide dielectric layers using in situ scanning electron microscope (SEM) investigations. The electromigration experiment was conducted with an extremely high current density of 1.14 × 107A cm2 under an ambient condition. Current stressing induced the nucleation, growth, and coalescence of nanovoids on grain boundaries. Nano-scale delamination at the local Cu oxide/Cu RDL interface occurred. The electromigration-induced reliability challenge correlated with the void evolution in the Cu RDL was reported for the failure behavior and mechanism.",
author = "Liang, {Chien Lung} and Lin, {Yung Sheng} and Tsai, {Min Yan} and Chiu, {Meng Chun} and Wang, {Shan Bo} and Hung, {Chih Pin} and Lin, {Kwang Lung}",
note = "Publisher Copyright: {\textcopyright} 2024 Japan Institute of Electronics Packaging.; 23rd International Conference on Electronics Packaging, ICEP 2024 ; Conference date: 17-04-2024 Through 20-04-2024",
year = "2024",
doi = "10.23919/ICEP61562.2024.10535693",
language = "English",
series = "2024 International Conference on Electronics Packaging, ICEP 2024",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
pages = "101--102",
booktitle = "2024 International Conference on Electronics Packaging, ICEP 2024",
address = "United States",
}