Dissolution behavior of Cu and Ag substrates in molten solders

Po Yi Yeh, Jenn Ming Song, Kwang Lung Lin

研究成果: Article同行評審

33 引文 斯高帕斯(Scopus)

摘要

This study investigated the dissolution behavior of Cu and Ag substrates in molten Sn, Sn-3.5Ag, Sn-4.0Ag-0.5Cu, Sn-8.6Zn and Sn-8.55Zn-0.5Ag-0.1Al-0.SGa lead-free solders as well as in Sn-37Pb solder for comparison at 300, 350, and 400°C. Results show that Sn-Zn alloys have a substantially lower dissolution rate of both Cu and Ag substrates than the other solders. Differences in interfacial intermetallic compounds formed during reaction and the morphology of these compounds strongly affected the substrate dissolution behavior. Soldering temperature and the corresponding solubility limit of the substrate elements in the liquid solder also played important roles in the interfacial morphology and dissolution rate of substrate.

原文English
頁(從 - 到)978-987
頁數10
期刊Journal of Electronic Materials
35
發行號5
DOIs
出版狀態Published - 2006 5月

All Science Journal Classification (ASJC) codes

  • 電子、光磁材料
  • 凝聚態物理學
  • 電氣與電子工程
  • 材料化學

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