Dry etch challenges of 0.25 μm dual damascene structures

R. F. Schnabel, D. Dobuzinski, F. Wang, D. C. Perng, J. Gambino, H. Palm

研究成果: Article

2 引文 斯高帕斯(Scopus)
原文English
頁(從 - 到)102-104
頁數3
期刊Vide: Science, Technique et Applications
53
發行號283 SUPPL.
出版狀態Published - 1997 十二月 1

All Science Journal Classification (ASJC) codes

  • Physics and Astronomy (miscellaneous)
  • Surfaces and Interfaces
  • Surfaces, Coatings and Films

引用此

Schnabel, R. F., Dobuzinski, D., Wang, F., Perng, D. C., Gambino, J., & Palm, H. (1997). Dry etch challenges of 0.25 μm dual damascene structures. Vide: Science, Technique et Applications, 53(283 SUPPL.), 102-104.