Early failure induced by phase transformation in microjoints for chip-level integration

Ren Shin Cheng, Hung Jen Chang, Tao Chih Chang, Jung Hua Chou

研究成果: Article同行評審

4 引文 斯高帕斯(Scopus)

摘要

The undercut issue of the CuNiSn2.5Ag microbump has been solved by reducing the Cu seed layer thickness and dry etching, but the bump height uniformity was degraded. Therefore, microjoints with different standoff heights were acquired by both thermocompressive bonding and reflow soldering. The numerical analyses indicated that the microjoints with a lower standoff sustained a higher fatigue stress under temperature cycling and the growth of Ni 3Sn 4 layer was more rapid because of a shorter diffusion route, which hastened the formation of micropores in the interconnection zone and was the root-cause of early failure.

原文English
頁(從 - 到)H75-H77
期刊Electrochemical and Solid-State Letters
15
發行號3
DOIs
出版狀態Published - 2012

All Science Journal Classification (ASJC) codes

  • 化學工程 (全部)
  • 材料科學(全部)
  • 物理與理論化學
  • 電化學
  • 電氣與電子工程

指紋

深入研究「Early failure induced by phase transformation in microjoints for chip-level integration」主題。共同形成了獨特的指紋。

引用此