Effect of Accelerating Voltage and Specimen Thickness on Spatial Resolutions of t-EBSD in Copper

Z.W. Shia, C.W. Kuo, T.Y. Kuo, Jui-Chao Kuo

研究成果: Conference contribution

原文	English
主出版物標題	International Conference & Exhibition on Advanced & Nano Materials (ICANM)
出版地	Montreal, Quebec, Canada
出版狀態	Published - 2016 8月 1

引用此

@inproceedings{37e665ee7d0e4ca3b09439639dcd4dd5,

title = "Effect of Accelerating Voltage and Specimen Thickness on Spatial Resolutions of t-EBSD in Copper",

author = "Z.W. Shia and C.W. Kuo and T.Y. Kuo and Jui-Chao Kuo",

year = "2016",

month = aug,

day = "1",

language = "English",

booktitle = "International Conference & Exhibition on Advanced & Nano Materials (ICANM)",

}