Effect of Accelerating Voltage and Specimen Thickness on Spatial Resolutions of t-EBSD in Copper

Z.W. Shia, C.W. Kuo, T.Y. Kuo, Jui-Chao Kuo

研究成果: Conference contribution

原文English
主出版物標題International Conference & Exhibition on Advanced & Nano Materials (ICANM)
出版地Montreal, Quebec, Canada
出版狀態Published - 2016 八月 1

引用此文

Shia, Z. W., Kuo, C. W., Kuo, T. Y., & Kuo, J-C. (2016). Effect of Accelerating Voltage and Specimen Thickness on Spatial Resolutions of t-EBSD in Copper. 於 International Conference & Exhibition on Advanced & Nano Materials (ICANM) Montreal, Quebec, Canada.
Shia, Z.W. ; Kuo, C.W. ; Kuo, T.Y. ; Kuo, Jui-Chao. / Effect of Accelerating Voltage and Specimen Thickness on Spatial Resolutions of t-EBSD in Copper. International Conference & Exhibition on Advanced & Nano Materials (ICANM). Montreal, Quebec, Canada, 2016.
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Shia, ZW, Kuo, CW, Kuo, TY & Kuo, J-C 2016, Effect of Accelerating Voltage and Specimen Thickness on Spatial Resolutions of t-EBSD in Copper. 於 International Conference & Exhibition on Advanced & Nano Materials (ICANM). Montreal, Quebec, Canada.

Effect of Accelerating Voltage and Specimen Thickness on Spatial Resolutions of t-EBSD in Copper. / Shia, Z.W.; Kuo, C.W.; Kuo, T.Y.; Kuo, Jui-Chao.

International Conference & Exhibition on Advanced & Nano Materials (ICANM). Montreal, Quebec, Canada, 2016.

研究成果: Conference contribution

TY - GEN

T1 - Effect of Accelerating Voltage and Specimen Thickness on Spatial Resolutions of t-EBSD in Copper

AU - Shia, Z.W.

AU - Kuo, C.W.

AU - Kuo, T.Y.

AU - Kuo, Jui-Chao

PY - 2016/8/1

Y1 - 2016/8/1

M3 - Conference contribution

BT - International Conference & Exhibition on Advanced & Nano Materials (ICANM)

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Shia ZW, Kuo CW, Kuo TY, Kuo J-C. Effect of Accelerating Voltage and Specimen Thickness on Spatial Resolutions of t-EBSD in Copper. 於 International Conference & Exhibition on Advanced & Nano Materials (ICANM). Montreal, Quebec, Canada. 2016