TY - GEN
T1 - Effect of cooling rate on Ag3Sn formation in Sn-Ag based lead-free solder
AU - Lee, Hwa Teng
AU - Chen, Yin Fa
AU - Hong, Ting Fu
AU - Shih, Ku Ta
PY - 2009
Y1 - 2009
N2 - Effect of solidification cooling rate on Ag3Sn formation and its morphological appearance in Sn-Ag based lead-free solder was investigated. Depends on cooling rate, three types of Ag3Sn compound with different morphologies may form by solidification. They are particle-like, needle-like, and platelike respectively. Small particle-like Ag3Sn in large amount was occurred by rapid cooling, where plate liked Ag3Sn was formed by slow cooling condition. Extremely slow cooling such as furnace cooling results large plate-like or pillar-like Ag3Sn to form, particularly in solder matrix adjacent to the solder/Cu interface. The enrichment of Sn in Cu 6Sn5 IMC layer formation at interface causes Sn depletion at the adjacent area near the interface. As a result, Ag atoms were enriched relatively which favored formation and growth of primary Ag3Sn in liquid phase.
AB - Effect of solidification cooling rate on Ag3Sn formation and its morphological appearance in Sn-Ag based lead-free solder was investigated. Depends on cooling rate, three types of Ag3Sn compound with different morphologies may form by solidification. They are particle-like, needle-like, and platelike respectively. Small particle-like Ag3Sn in large amount was occurred by rapid cooling, where plate liked Ag3Sn was formed by slow cooling condition. Extremely slow cooling such as furnace cooling results large plate-like or pillar-like Ag3Sn to form, particularly in solder matrix adjacent to the solder/Cu interface. The enrichment of Sn in Cu 6Sn5 IMC layer formation at interface causes Sn depletion at the adjacent area near the interface. As a result, Ag atoms were enriched relatively which favored formation and growth of primary Ag3Sn in liquid phase.
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U2 - 10.1109/EPTC.2009.5416420
DO - 10.1109/EPTC.2009.5416420
M3 - Conference contribution
AN - SCOPUS:77950928198
SN - 9781424451005
T3 - Proceedings of the Electronic Packaging Technology Conference, EPTC
SP - 875
EP - 878
BT - EPTC 2009 - Proceedings of 2009 11th Electronic Packaging Technology Conference
T2 - 2009 11th Electronic Packaging Technology Conference, EPTC 2009
Y2 - 9 December 2009 through 11 December 2009
ER -