Effect of cooling rate on Ag3Sn formation in Sn-Ag based lead-free solder

Hwa Teng Lee, Yin Fa Chen, Ting Fu Hong, Ku Ta Shih

研究成果: Conference contribution

12 引文 斯高帕斯(Scopus)

摘要

Effect of solidification cooling rate on Ag3Sn formation and its morphological appearance in Sn-Ag based lead-free solder was investigated. Depends on cooling rate, three types of Ag3Sn compound with different morphologies may form by solidification. They are particle-like, needle-like, and platelike respectively. Small particle-like Ag3Sn in large amount was occurred by rapid cooling, where plate liked Ag3Sn was formed by slow cooling condition. Extremely slow cooling such as furnace cooling results large plate-like or pillar-like Ag3Sn to form, particularly in solder matrix adjacent to the solder/Cu interface. The enrichment of Sn in Cu 6Sn5 IMC layer formation at interface causes Sn depletion at the adjacent area near the interface. As a result, Ag atoms were enriched relatively which favored formation and growth of primary Ag3Sn in liquid phase.

原文English
主出版物標題EPTC 2009 - Proceedings of 2009 11th Electronic Packaging Technology Conference
頁面875-878
頁數4
DOIs
出版狀態Published - 2009
事件2009 11th Electronic Packaging Technology Conference, EPTC 2009 - Singapore, Singapore
持續時間: 2009 12月 92009 12月 11

出版系列

名字Proceedings of the Electronic Packaging Technology Conference, EPTC

Other

Other2009 11th Electronic Packaging Technology Conference, EPTC 2009
國家/地區Singapore
城市Singapore
期間09-12-0909-12-11

All Science Journal Classification (ASJC) codes

  • 電氣與電子工程
  • 電子、光磁材料
  • 凝聚態物理學

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