Effect of copper concentration in the electrolyte on the surface morphology and the microstructure of CuInSe 2 films

Pin Kun Hung, Ting Wei Kuo, Kuo Chan Huang, Na Fu Wang, Po Tsung Hsieh, Mau Phon Houng

研究成果: Letter同行評審

4 引文 斯高帕斯(Scopus)

摘要

The surface morphology and the microstructure of CuInSe 2 precursor films have been investigated by co-electrodeposition with different [Cu 2+ ] concentrations from 2 mM to 4 mM. The characteristic of the precursor films was examined using field-emission scanning electron microscopy (FE-SEM), energy dispersive X-ray spectroscopy (EDS), glancing incidence angle X-ray diffraction (GIXRD) and micro-Raman spectrometer, respectively. The surface morphology of the precursor films become more smoother and compact with choice of appropriate [Cu 2+ ] concentration (3-3.5 mM) in the electrolyte. The relation between surface morphology and [Cu 2+ ] concentration is also considered in terms of electrodeposition nucleation mechanisms using the mathematical models of Scharifker and Hills. It is suggested that the higher [Cu 2+ ] concentrations can provide more numbers of nucleation sites on the surface of the electrode. Results simulated from the Rietveld refinement method suggest that decreasing d CuSe is related to charge transfer from interstitial copper atoms and can affect the film microstructure. Micro-Raman spectrum also shows that the excess Cu atoms in the precursor films does not contribute significantly to large amounts of secondary phases but rather exists in the crystallite structure as other defect types.

原文English
頁(從 - 到)7238-7243
頁數6
期刊Applied Surface Science
258
發行號18
DOIs
出版狀態Published - 2012 7月 1

All Science Journal Classification (ASJC) codes

  • 化學 (全部)
  • 凝聚態物理學
  • 物理與天文學 (全部)
  • 表面和介面
  • 表面、塗料和薄膜

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