Effect of copper concentration in the electrolyte on the surface morphology and the microstructure of CuInSe 2 films

Pin Kun Hung, Ting Wei Kuo, Kuo Chan Huang, Na Fu Wang, Po Tsung Hsieh, Mau Phon Houng

研究成果: Letter

4 引文 (Scopus)

摘要

The surface morphology and the microstructure of CuInSe 2 precursor films have been investigated by co-electrodeposition with different [Cu 2+ ] concentrations from 2 mM to 4 mM. The characteristic of the precursor films was examined using field-emission scanning electron microscopy (FE-SEM), energy dispersive X-ray spectroscopy (EDS), glancing incidence angle X-ray diffraction (GIXRD) and micro-Raman spectrometer, respectively. The surface morphology of the precursor films become more smoother and compact with choice of appropriate [Cu 2+ ] concentration (3-3.5 mM) in the electrolyte. The relation between surface morphology and [Cu 2+ ] concentration is also considered in terms of electrodeposition nucleation mechanisms using the mathematical models of Scharifker and Hills. It is suggested that the higher [Cu 2+ ] concentrations can provide more numbers of nucleation sites on the surface of the electrode. Results simulated from the Rietveld refinement method suggest that decreasing d CuSe is related to charge transfer from interstitial copper atoms and can affect the film microstructure. Micro-Raman spectrum also shows that the excess Cu atoms in the precursor films does not contribute significantly to large amounts of secondary phases but rather exists in the crystallite structure as other defect types.

原文English
頁(從 - 到)7238-7243
頁數6
期刊Applied Surface Science
258
發行號18
DOIs
出版狀態Published - 2012 七月 1

指紋

Electrolytes
Surface morphology
Copper
Microstructure
Electrodeposition
Nucleation
Atoms
Rietveld refinement
Field emission
Spectrometers
Charge transfer
Raman scattering
Energy dispersive spectroscopy
Mathematical models
X ray diffraction
Defects
Scanning electron microscopy
Electrodes

All Science Journal Classification (ASJC) codes

  • Chemistry(all)
  • Condensed Matter Physics
  • Physics and Astronomy(all)
  • Surfaces and Interfaces
  • Surfaces, Coatings and Films

引用此文

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title = "Effect of copper concentration in the electrolyte on the surface morphology and the microstructure of CuInSe 2 films",
abstract = "The surface morphology and the microstructure of CuInSe 2 precursor films have been investigated by co-electrodeposition with different [Cu 2+ ] concentrations from 2 mM to 4 mM. The characteristic of the precursor films was examined using field-emission scanning electron microscopy (FE-SEM), energy dispersive X-ray spectroscopy (EDS), glancing incidence angle X-ray diffraction (GIXRD) and micro-Raman spectrometer, respectively. The surface morphology of the precursor films become more smoother and compact with choice of appropriate [Cu 2+ ] concentration (3-3.5 mM) in the electrolyte. The relation between surface morphology and [Cu 2+ ] concentration is also considered in terms of electrodeposition nucleation mechanisms using the mathematical models of Scharifker and Hills. It is suggested that the higher [Cu 2+ ] concentrations can provide more numbers of nucleation sites on the surface of the electrode. Results simulated from the Rietveld refinement method suggest that decreasing d CuSe is related to charge transfer from interstitial copper atoms and can affect the film microstructure. Micro-Raman spectrum also shows that the excess Cu atoms in the precursor films does not contribute significantly to large amounts of secondary phases but rather exists in the crystallite structure as other defect types.",
author = "Hung, {Pin Kun} and Kuo, {Ting Wei} and Huang, {Kuo Chan} and Wang, {Na Fu} and Hsieh, {Po Tsung} and Houng, {Mau Phon}",
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Effect of copper concentration in the electrolyte on the surface morphology and the microstructure of CuInSe 2 films . / Hung, Pin Kun; Kuo, Ting Wei; Huang, Kuo Chan; Wang, Na Fu; Hsieh, Po Tsung; Houng, Mau Phon.

於: Applied Surface Science, 卷 258, 編號 18, 01.07.2012, p. 7238-7243.

研究成果: Letter

TY - JOUR

T1 - Effect of copper concentration in the electrolyte on the surface morphology and the microstructure of CuInSe 2 films

AU - Hung, Pin Kun

AU - Kuo, Ting Wei

AU - Huang, Kuo Chan

AU - Wang, Na Fu

AU - Hsieh, Po Tsung

AU - Houng, Mau Phon

PY - 2012/7/1

Y1 - 2012/7/1

N2 - The surface morphology and the microstructure of CuInSe 2 precursor films have been investigated by co-electrodeposition with different [Cu 2+ ] concentrations from 2 mM to 4 mM. The characteristic of the precursor films was examined using field-emission scanning electron microscopy (FE-SEM), energy dispersive X-ray spectroscopy (EDS), glancing incidence angle X-ray diffraction (GIXRD) and micro-Raman spectrometer, respectively. The surface morphology of the precursor films become more smoother and compact with choice of appropriate [Cu 2+ ] concentration (3-3.5 mM) in the electrolyte. The relation between surface morphology and [Cu 2+ ] concentration is also considered in terms of electrodeposition nucleation mechanisms using the mathematical models of Scharifker and Hills. It is suggested that the higher [Cu 2+ ] concentrations can provide more numbers of nucleation sites on the surface of the electrode. Results simulated from the Rietveld refinement method suggest that decreasing d CuSe is related to charge transfer from interstitial copper atoms and can affect the film microstructure. Micro-Raman spectrum also shows that the excess Cu atoms in the precursor films does not contribute significantly to large amounts of secondary phases but rather exists in the crystallite structure as other defect types.

AB - The surface morphology and the microstructure of CuInSe 2 precursor films have been investigated by co-electrodeposition with different [Cu 2+ ] concentrations from 2 mM to 4 mM. The characteristic of the precursor films was examined using field-emission scanning electron microscopy (FE-SEM), energy dispersive X-ray spectroscopy (EDS), glancing incidence angle X-ray diffraction (GIXRD) and micro-Raman spectrometer, respectively. The surface morphology of the precursor films become more smoother and compact with choice of appropriate [Cu 2+ ] concentration (3-3.5 mM) in the electrolyte. The relation between surface morphology and [Cu 2+ ] concentration is also considered in terms of electrodeposition nucleation mechanisms using the mathematical models of Scharifker and Hills. It is suggested that the higher [Cu 2+ ] concentrations can provide more numbers of nucleation sites on the surface of the electrode. Results simulated from the Rietveld refinement method suggest that decreasing d CuSe is related to charge transfer from interstitial copper atoms and can affect the film microstructure. Micro-Raman spectrum also shows that the excess Cu atoms in the precursor films does not contribute significantly to large amounts of secondary phases but rather exists in the crystallite structure as other defect types.

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