Effect of Cu drift on dielectric breakdown for porous low dielectric constant film under static and dynamic stress

Yi Lung Cheng, Yao Liang Huang, Chung Ren Sun, Wen Hsi Lee, Giin Shan Chen, Jau Shiung Fang

研究成果: Conference contribution

1 引文 斯高帕斯(Scopus)

指紋 深入研究「Effect of Cu drift on dielectric breakdown for porous low dielectric constant film under static and dynamic stress」主題。共同形成了獨特的指紋。

Engineering & Materials Science