Effect of current density and plating time on the morphology of copper electrodeposits on an AFM tip

K. L. Lin, S. Y. Chen, U. S. Mohanty

研究成果: Article同行評審

4 引文 斯高帕斯(Scopus)

摘要

An attempt was made to electrodeposit copper on a nanosize atomic force microscopy (AFM) tip by varying the magnitude of current densities with plating time and vice versa. Changes in the current density and plating time resulted in significant changes in the morphology of copper deposits on the AFM probe containing the tip. Scanning electron microscopy (SEM) results revealed that a nonuniform layer of copper was formed on the open areas surrounding the tip; however, no copper deposition was observed on the AFM tip in the absence of photoresist poly(methyl methacrylate) (PMMA). The electron-beam lithography technique proved to be a versatile tool for the electrodeposition of copper on the AFM tip in the presence of photoresist PMMA. Copper was electrochemically deposited on the e-beam modified regions of the AFM probe at a current density of 0.6 A/ dm2 with plating times ranging from 300 to 2400 s.

原文English
頁(從 - 到)D251-D255
期刊Journal of the Electrochemical Society
155
發行號4
DOIs
出版狀態Published - 2008 三月 14

All Science Journal Classification (ASJC) codes

  • 電子、光磁材料
  • 可再生能源、永續發展與環境
  • 表面、塗料和薄膜
  • 電化學
  • 材料化學

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