Effect of Electromigration on Micro Tensile Test Mechanical Properties and Micro Structure of Pure Copper

Engineering

• Tensile Test 100%
• Microstructure 100%
• Electromigration 100%
• Pure Copper 100%
• Electronic Packaging 20%
• Yield Point 20%
• Tensiles 20%
• Young's Modulus 20%
• Ultimate Tensile Strength 20%
• Residual Stress 20%
• Tensile Stress σ 20%
• Grain Orientation 20%
• Microstructure Evolution 20%

Material Science

• Electronic Circuit 100%
• Microstructure 100%
• Ultimate Tensile Strength 66%
• Density 33%
• Electron Backscatter Diffraction 33%
• Yield Stress 33%
• Young's Modulus 33%
• Residual Stress 33%

Keyphrases

• Copper Circuit 20%
• Packaging Substrate 20%