Effect of isothermal aging at 250°C on shear strength of joints using Au nanoporous bonding for die attach

H. Nishikawa; K. Matsunaga; M. S. Kim; M. Saito; J. Mizuno

doi:10.4071/2016-hitec-143

Effect of isothermal aging at 250°C on shear strength of joints using Au nanoporous bonding for die attach

H. Nishikawa, K. Matsunaga, M. S. Kim, M. Saito, J. Mizuno

智慧與永續製造學位學程

研究成果: Paper › 同行評審

摘要

High-Temperature joining is a key technology for electronic component assembly and other high-Temperature applications. Recently, focusing on the sintering behavior of metal particles, the joining process using a nanoparticle paste has been proposed as an alternative to establish a high-Temperature joining technology. In this study, a feasibility study has been conducted to determine whether an Au nanoporous sheet can be used for joint material. We evaluated the effect of isothermal aging at 250 °C on shear strength of joints using an Au nanoporous sheet. The shear strength of the joint after isothermal storage at 250 °C for 1000h was more than 25 MPa.

原文	English
DOIs	https://doi.org/10.4071/2016-hitec-143
出版狀態	Published - 2016
事件	IMAPS International Conference and Exhibition on High Temperature Electronics, HiTEC 2016 - Albuquerque, United States 持續時間: 2016 5月 10 → 2016 5月 12

Conference

Conference	IMAPS International Conference and Exhibition on High Temperature Electronics, HiTEC 2016
國家/地區	United States
城市	Albuquerque
期間	16-05-10 → 16-05-12

All Science Journal Classification (ASJC) codes

電氣與電子工程

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10.4071/2016-hitec-143

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AU - Nishikawa, H.

AU - Matsunaga, K.

AU - Kim, M. S.

AU - Saito, M.

AU - Mizuno, J.

PY - 2016

Y1 - 2016

N2 - High-Temperature joining is a key technology for electronic component assembly and other high-Temperature applications. Recently, focusing on the sintering behavior of metal particles, the joining process using a nanoparticle paste has been proposed as an alternative to establish a high-Temperature joining technology. In this study, a feasibility study has been conducted to determine whether an Au nanoporous sheet can be used for joint material. We evaluated the effect of isothermal aging at 250 °C on shear strength of joints using an Au nanoporous sheet. The shear strength of the joint after isothermal storage at 250 °C for 1000h was more than 25 MPa.

AB - High-Temperature joining is a key technology for electronic component assembly and other high-Temperature applications. Recently, focusing on the sintering behavior of metal particles, the joining process using a nanoparticle paste has been proposed as an alternative to establish a high-Temperature joining technology. In this study, a feasibility study has been conducted to determine whether an Au nanoporous sheet can be used for joint material. We evaluated the effect of isothermal aging at 250 °C on shear strength of joints using an Au nanoporous sheet. The shear strength of the joint after isothermal storage at 250 °C for 1000h was more than 25 MPa.

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M3 - Paper

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Y2 - 10 May 2016 through 12 May 2016

ER -

Effect of isothermal aging at 250°C on shear strength of joints using Au nanoporous bonding for die attach

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