Effect of low temperature on the micro-impact fracture behavior of Sn-Ag-Cu solder joint

D. S. Liu, C. L. Hsu, C. Y. Kuo, Y. L. Huang, K. L. Lin, G. S. Shen

研究成果: Conference contribution

1 引文 斯高帕斯(Scopus)

摘要

In this work, the failure characteristics of lead-free solder joint were investigated with low temperature micro-impact test. A impact testing method with shear rate of 1 m/s and temperatures ranging from room temperature to -40°C was set up to measure the interfacial strength of solder joints for evaluating the reliability. Experimental results have shown that the testing temperatures were found to have strong effects on the impact resistance and fracture mechanisms of Sn-Ag-Cu lead-free solder joint. The failure mode percentage, the peak load, and the energy to peak load under changing low temperature conditions will be presented in this paper.

原文English
主出版物標題International Microsystems Packaging Assembly and Circuits Technology Conference, IMPACT 2010 and International 3D IC Conference, Proceedings
DOIs
出版狀態Published - 2010 十二月 1
事件2010 5th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2010 and International 3D IC Conference - Taipei, Taiwan
持續時間: 2010 十月 202010 十月 22

出版系列

名字International Microsystems Packaging Assembly and Circuits Technology Conference, IMPACT 2010 and International 3D IC Conference, Proceedings

Other

Other2010 5th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2010 and International 3D IC Conference
國家Taiwan
城市Taipei
期間10-10-2010-10-22

    指紋

All Science Journal Classification (ASJC) codes

  • Hardware and Architecture
  • Electrical and Electronic Engineering

引用此

Liu, D. S., Hsu, C. L., Kuo, C. Y., Huang, Y. L., Lin, K. L., & Shen, G. S. (2010). Effect of low temperature on the micro-impact fracture behavior of Sn-Ag-Cu solder joint. 於 International Microsystems Packaging Assembly and Circuits Technology Conference, IMPACT 2010 and International 3D IC Conference, Proceedings [5699648] (International Microsystems Packaging Assembly and Circuits Technology Conference, IMPACT 2010 and International 3D IC Conference, Proceedings). https://doi.org/10.1109/IMPACT.2010.5699648