Effect of microstructural evolution on electrical property of the Sn-Ag-Cu solder balls joined with Sn-Zn-Bi paste

Po Cheng Shih, Kwang Lung Lin

研究成果: Article同行評審

2 引文 斯高帕斯(Scopus)

摘要

Sn-8Zn-3Bi solder paste and Sn-3.2Ag-0.5Cu solder balls were reflowed simultaneously on Cu/Ni/Au metallized ball grid array (BGA) substrates. The correlation between microstructural evolution and the electrical resistance of the joints under various testing conditions of reflow cycles and heat treatment was investigated. The electrical resistance of the Sn-Ag-Cu joints without Sn-Zn-Bi was also conducted for comparison. The average resistance values of Sn-Ag-Cu and Sn-Ag-Cu/Sn-Zn-Bi samples changed, respectively, from 7.1 (single reflow) to 7.3 (10 cycles) mΩ and from 7.2 (single reflow) to 7.6 (10 cycles) mΩ. Furthermore, the average resistance values of Sn-Ag-Cu and Sn-Ag-Cu/ Sn-Zn-Bi samples changed, respectively, from 7.1 (aging 0 h) to 7.8 (aging 1000 h) mΩ and from 7.2 (aging 0 h) to 7.9 (aging 1000 h) mΩ. It was also noticeable that the average resistance values of Sn-Ag-Cu/Sn-Zn-Bi samples were higher than those of Sn-Ag-Cu samples in each specified testing condition. The possible reasons for the greater resistance exhibited by the Sn-Zn-Bi incorporated joints were discussed.

原文English
頁(從 - 到)2854-2865
頁數12
期刊Journal of Materials Research
20
發行號10
DOIs
出版狀態Published - 2005 十月

All Science Journal Classification (ASJC) codes

  • 材料科學(全部)
  • 凝聚態物理學
  • 材料力學
  • 機械工業

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