Effect of oxidizer on the galvanic behavior of Cu/Ta coupling during chemical mechanical polishing

Szu Jung Pan, Jui Chin Chen, Wen Ta Tsai

研究成果: Article同行評審

2 引文 斯高帕斯(Scopus)

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深入研究「Effect of oxidizer on the galvanic behavior of Cu/Ta coupling during chemical mechanical polishing」主題。共同形成了獨特的指紋。

Chemical Compounds

Engineering & Materials Science