Effect of package and board characteristics on solder joint reliability of microstar BGA

Manjula Variyam, Tz Cheng Chiu, Vish Sundararaman, Darvin Edwards

研究成果: Conference article同行評審

3 引文 斯高帕斯(Scopus)

摘要

Consumer demand for smaller, lower cost devices with more functionality is driving the use of ball grid array (BGA) chip scale packages (CSP) in applications ranging from wireless hand-helds to broadband gear in central office and out-door infrastructure. These different applications have widely different use-environments and reliability requirements. This gives rise to issues of consistent board-level reliability for a package under various assembly requirements and environmental conditions. It becomes necessary to understand how assembly factors such as board thickness and pad finish affect the T/C board-level solder joint reliability (BL-SJR) of the package in order to assess the reliability across different applications. A study was conducted on Texas Instrument (TI)'s MicroStar BGA™ (μ*BGA) package to understand the impact of package size, board thickness, and board-pad finish on the BL-SJR lifetime of the package. From test and simulation data, it was found that the combination of small package, thin board and organic surface protectant (OSP) pad finish resulted in long lifetimes under BL-SJR test conditions.

原文English
頁(從 - 到)583-588
頁數6
期刊Proceedings - Electronic Components and Technology Conference
出版狀態Published - 2003 七月 17
事件53rd Electronic Components and Technology Conference 2003 - New Orleans LA, United States
持續時間: 2003 五月 272003 五月 30

All Science Journal Classification (ASJC) codes

  • 電子、光磁材料
  • 電氣與電子工程

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