Effect of plating current density and frequency on the crystallographic texture of electrodeposited copper

Ya Wen Lin, Jui Chao Kuo, Kuan Tai Lui, Delphic Chen

研究成果: Conference contribution

6 引文 斯高帕斯(Scopus)

摘要

For interconnect materials in the microelectronic technology copper has replaced aluminum due to its lower resistivity, higher thermal conductivity and better electromigration resistance. Recently, it was found that nanotwinned copper exhibits ultra high yield strength, ductility and electrical conductivity. Therefore, in this study the effect of plating current density and frequency were investigated on the crystallographic texture of Cu electrodeposited to understand the twin character. Electron backscatter diffraction (EBSD) was used for characterizing the preferred orientation, grain size distribution, and grain boundary character distribution. Three kinds of 〈110〉, 〈111〉 and 〈112〉 textures were found to be related with the electrodeposited parameters of current density and frequency. Here we will discuss the relationship between the preferred orientation and the electrodeposited parameters.

原文English
主出版物標題THERMEC 2009
頁面2841-2845
頁數5
DOIs
出版狀態Published - 2010 二月 9
事件6th International Conference on Processing and Manufacturing of Advanced Materials - THERMEC'2009 - Berlin, Germany
持續時間: 2009 八月 252009 八月 29

出版系列

名字Materials Science Forum
638-642
ISSN(列印)0255-5476

Other

Other6th International Conference on Processing and Manufacturing of Advanced Materials - THERMEC'2009
國家Germany
城市Berlin
期間09-08-2509-08-29

    指紋

All Science Journal Classification (ASJC) codes

  • Materials Science(all)
  • Condensed Matter Physics
  • Mechanics of Materials
  • Mechanical Engineering

引用此

Lin, Y. W., Kuo, J. C., Lui, K. T., & Chen, D. (2010). Effect of plating current density and frequency on the crystallographic texture of electrodeposited copper. 於 THERMEC 2009 (頁 2841-2845). (Materials Science Forum; 卷 638-642). https://doi.org/10.4028/www.scientific.net/MSF.638-642.2841