Effect of Pulse Plating Frequency on Properties of Electrodeposited Copper Films

Ya-Wen Lin, Delphic Chen, Jui-Chao Kuo

研究成果: Conference contribution

原文English
主出版物標題International Thin Films Conference TACT 2011
出版地Kenting, Taiwan
出版狀態Published - 2011 11月 20

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