Effect of stiffness and thickness ratios on popcorn cracking in IC packages

Ching Hwei Chue, Teng Hui Chen, Hwa-Teng Lee

研究成果: Article

2 引文 (Scopus)

摘要

During the solder reflow process, popcorn cracking will occur in integrated circuit (IC) package under vapor pressure and thermal load. Based on the elasticity theory, the singular stress field around the apex of the delaminated interface between die-pad and resin is obtained numerically. The generalized stress intensity factors are computed to evaluate the residual strength of the structure. Also, the structural stability is discussed by using the strain energy density theory. Two factors that are concerned in this paper include the relative stiffness ratio Edie-pad/Eresin and the relative thickness h̄. The results show that lower stiffness ratio gives weaker stress singularity. In addition, larger h̄ will increase generalized stress intensity factors and structural stability. As a conclusion for our case, moderate value of h̄ (say h̄ = 0) is recommended for design.

原文English
頁(從 - 到)340-348
頁數9
期刊IEEE Transactions on Components and Packaging Technologies
26
發行號2
DOIs
出版狀態Published - 2003 六月 1

指紋

Stress intensity factors
Integrated circuits
Stiffness
Thermal load
Strain energy
Vapor pressure
Soldering alloys
Elasticity
Resins

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Electrical and Electronic Engineering

引用此文

@article{a591dacd1fab43bc8c987d63965ab8c1,
title = "Effect of stiffness and thickness ratios on popcorn cracking in IC packages",
abstract = "During the solder reflow process, popcorn cracking will occur in integrated circuit (IC) package under vapor pressure and thermal load. Based on the elasticity theory, the singular stress field around the apex of the delaminated interface between die-pad and resin is obtained numerically. The generalized stress intensity factors are computed to evaluate the residual strength of the structure. Also, the structural stability is discussed by using the strain energy density theory. Two factors that are concerned in this paper include the relative stiffness ratio Edie-pad/Eresin and the relative thickness h̄. The results show that lower stiffness ratio gives weaker stress singularity. In addition, larger h̄ will increase generalized stress intensity factors and structural stability. As a conclusion for our case, moderate value of h̄ (say h̄ = 0) is recommended for design.",
author = "Chue, {Ching Hwei} and Chen, {Teng Hui} and Hwa-Teng Lee",
year = "2003",
month = "6",
day = "1",
doi = "10.1109/TCAPT.2003.815097",
language = "English",
volume = "26",
pages = "340--348",
journal = "IEEE Transactions on Components and Packaging Technologies",
issn = "1521-3331",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
number = "2",

}

Effect of stiffness and thickness ratios on popcorn cracking in IC packages. / Chue, Ching Hwei; Chen, Teng Hui; Lee, Hwa-Teng.

於: IEEE Transactions on Components and Packaging Technologies, 卷 26, 編號 2, 01.06.2003, p. 340-348.

研究成果: Article

TY - JOUR

T1 - Effect of stiffness and thickness ratios on popcorn cracking in IC packages

AU - Chue, Ching Hwei

AU - Chen, Teng Hui

AU - Lee, Hwa-Teng

PY - 2003/6/1

Y1 - 2003/6/1

N2 - During the solder reflow process, popcorn cracking will occur in integrated circuit (IC) package under vapor pressure and thermal load. Based on the elasticity theory, the singular stress field around the apex of the delaminated interface between die-pad and resin is obtained numerically. The generalized stress intensity factors are computed to evaluate the residual strength of the structure. Also, the structural stability is discussed by using the strain energy density theory. Two factors that are concerned in this paper include the relative stiffness ratio Edie-pad/Eresin and the relative thickness h̄. The results show that lower stiffness ratio gives weaker stress singularity. In addition, larger h̄ will increase generalized stress intensity factors and structural stability. As a conclusion for our case, moderate value of h̄ (say h̄ = 0) is recommended for design.

AB - During the solder reflow process, popcorn cracking will occur in integrated circuit (IC) package under vapor pressure and thermal load. Based on the elasticity theory, the singular stress field around the apex of the delaminated interface between die-pad and resin is obtained numerically. The generalized stress intensity factors are computed to evaluate the residual strength of the structure. Also, the structural stability is discussed by using the strain energy density theory. Two factors that are concerned in this paper include the relative stiffness ratio Edie-pad/Eresin and the relative thickness h̄. The results show that lower stiffness ratio gives weaker stress singularity. In addition, larger h̄ will increase generalized stress intensity factors and structural stability. As a conclusion for our case, moderate value of h̄ (say h̄ = 0) is recommended for design.

UR - http://www.scopus.com/inward/record.url?scp=0042466541&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=0042466541&partnerID=8YFLogxK

U2 - 10.1109/TCAPT.2003.815097

DO - 10.1109/TCAPT.2003.815097

M3 - Article

AN - SCOPUS:0042466541

VL - 26

SP - 340

EP - 348

JO - IEEE Transactions on Components and Packaging Technologies

JF - IEEE Transactions on Components and Packaging Technologies

SN - 1521-3331

IS - 2

ER -