Effective Computational Models for Addressing Asymmetric Warping of Fan-Out Reconstituted Wafer Packaging

Yu Chin Lee, Chia Yu Chen, Kuo Shen Chen, Jen Hsien Wong, Wei Hong Lai, Tang Yuan Chen, Dao Long Chen, David Tarng

研究成果: Conference contribution

1 引文 斯高帕斯（Scopus）

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Engineering & Materials Science

Chemical Compounds