Effects of (002) β-Ta barrier on copper chemical mechanical polishing behavior

Yu Sheng Wang, Kei Wei Chen, Min Yuan Cheng, Wen-Shi Lee, Ying Lang Wang

研究成果: Article同行評審

3 引文 斯高帕斯(Scopus)

摘要

This study proposes that the corrosion resistance of copper film correlates well with underlying barrier's orientation. To test the hypothesis, we performed X-ray diffraction, conducted copper removal rate experiments after chemical mechanical polishing, and tested static potentiodynamic polarization. The results all show that copper deposited on strongly (002) oriented β-Ta barrier layer demonstrated better chemical resistance against surface reaction with the slurry for strong copper (111) orientation. The findings were consistent with the result of the chronoamperometric test at 0.3 V in which the more passive film formed on the composite film with (002) β-Ta underlying barrier.

原文English
頁(從 - 到)435-438
頁數4
期刊Thin Solid Films
529
DOIs
出版狀態Published - 2013 二月 1

All Science Journal Classification (ASJC) codes

  • 電子、光磁材料
  • 表面和介面
  • 表面、塗料和薄膜
  • 金屬和合金
  • 材料化學

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