摘要
The effects of aging time on the mechanical properties of the Sn-9Zn-1.5Ag-xBi lead-free solder alloys are investigated using scanning electron microscopy (SEM), X-ray diffraction (XRD), transmission electron microscopy (TEM), selected area electron diffraction (SAED), energy dispersive spectrometry (EDS) and a universal testing machine. The experimental results show that the microstructure of Sn-9Zn- 1.5Ag-xBi solder alloys is composed of Sn-rich phase and AgZn3. No other intermetallic compounds (IMCs) with Bi content was observed in the solder matrix for Sn-9Zn-1.5Ag solder alloys with various Bi contents before and after aging at 150 °C for different durations. The lattice parameter increases significantly with increasing aging time or Bi addition. The size of Sn-rich grain increased gradually with aging time increased, but decreases with Bi content increases. The maximum yield strength is 112.7 2.2 MPa for Sn-9Zn-1.5Ag-3Bi solder alloy before aging.
原文 | English |
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頁(從 - 到) | 229-235 |
頁數 | 7 |
期刊 | Journal of Alloys and Compounds |
卷 | 582 |
DOIs | |
出版狀態 | Published - 2014 |
All Science Journal Classification (ASJC) codes
- 材料力學
- 機械工業
- 金屬和合金
- 材料化學