Effects of aging time on the mechanical properties of Sn-9Zn-1.5Ag-xBi lead-free solder alloys

Chih Yao Liu, Min Hsiung Hon, Moo Chin Wang, Ying Ru Chen, Kuo Ming Chang, Wang Long Li

研究成果: Article同行評審

19 引文 斯高帕斯(Scopus)

摘要

The effects of aging time on the mechanical properties of the Sn-9Zn-1.5Ag-xBi lead-free solder alloys are investigated using scanning electron microscopy (SEM), X-ray diffraction (XRD), transmission electron microscopy (TEM), selected area electron diffraction (SAED), energy dispersive spectrometry (EDS) and a universal testing machine. The experimental results show that the microstructure of Sn-9Zn- 1.5Ag-xBi solder alloys is composed of Sn-rich phase and AgZn3. No other intermetallic compounds (IMCs) with Bi content was observed in the solder matrix for Sn-9Zn-1.5Ag solder alloys with various Bi contents before and after aging at 150 °C for different durations. The lattice parameter increases significantly with increasing aging time or Bi addition. The size of Sn-rich grain increased gradually with aging time increased, but decreases with Bi content increases. The maximum yield strength is 112.7 2.2 MPa for Sn-9Zn-1.5Ag-3Bi solder alloy before aging.

原文English
頁(從 - 到)229-235
頁數7
期刊Journal of Alloys and Compounds
582
DOIs
出版狀態Published - 2014

All Science Journal Classification (ASJC) codes

  • Mechanics of Materials
  • Mechanical Engineering
  • Metals and Alloys
  • Materials Chemistry

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