切屑負載對矽研磨加工中相變化和殘留應力影響之研究

Yung Yuan Liao, Jiunn Jyh Junz Wang, Chao Yu Huang

研究成果: Article同行評審

摘要

This study examines the surface formation mechanism, near-surface residual stresses, phase transformations, and their interrelationships in surface grinding of silicon (100) under various chip loading conditions. Near-surface residual stresses of the ground surfaces are found to be all compressive for all chip loading conditions with the transverse residual stress more affected by the chip load. Through Raman spectra of the ground surface, it is shown that the Si-I phase tends to transform to Si-III/Si-XII at a lager chip load, and to amorphous phase at a smaller chip load. SEM surface topography reveals that the degree of plowing in surface formation increases with chip load, and that surface residual stress and phase transformation can be correlated to the extent of plowing phenomenon on the silicon surface during the material removal process. It is concluded that grinding condition with higher chip load leads to the formation of Si-III/Si-XII phases as well as a higher transverse surface residual stress while a smaller chip load is favorable in the formation of an amorphous phase and low residual stress.

貢獻的翻譯標題Effects of Chip Load on Phase Transformation and Residual Stress in Silicon Grinding
原文???core.languages.zh_TW???
頁(從 - 到)617-623
頁數7
期刊Journal of the Chinese Society of Mechanical Engineers, Transactions of the Chinese Institute of Engineers, Series C/Chung-Kuo Chi Hsueh Kung Ch'eng Hsuebo Pao
40
發行號6
出版狀態Published - 2019 十二月 1

All Science Journal Classification (ASJC) codes

  • Mechanical Engineering

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