Effects of Cooling Rate on the Microstructure and Morphology of Sn-3.0Ag-0.5Cu Solder

Physics & Astronomy

• cooling 54%
• ductility 13%
• eutectics 26%
• fine structure 11%
• grain size 10%
• hardness 21%
• leaves 14%
• liquid cooling 16%
• microstructure 47%
• needles 13%
• precipitates 11%
• rods 11%
• solders 90%
• tensile strength 25%

Engineering & Materials Science

• Cooling 56%
• Cooling water 14%
• Eutectics 28%
• Experiments 4%
• Hardness 21%
• Lead-free solders 16%
• Microstructure 54%
• Needles 14%
• Precipitates 13%
• Soldering alloys 79%
• Tensile strength 21%

Chemical Compounds

• Cooling 71%
• Cooling Water 18%
• Ductility 15%
• Eutectics 27%
• Grain Size 12%
• Microstructure 54%
• Solder 100%
• Tensile Strength 22%