Effects of current density and deposition time on electrical resistivity of electroplated Cu layers

Chien Tai Lin, Kwang Lung Lin

研究成果: Article同行評審

43 引文 斯高帕斯(Scopus)

摘要

This study was performed to investigate the effects of current density and deposition time on sheet resistance and resistivity of electroplated Cu layer. Cu layer covered on sputtered Si/Ta/22Cu-78Ta/Cu films was electroplated with current densities of 1, 1.5 and 2A/dm2, and the deposition times varied from 20 to 100 min. The effects of current density and deposition time on the thickness of Cu layers and the current efficiency were investigated. The variation in sheet resistance and resistivity more discussed with respect to thickness, surface roughness, microstructure, grain size, and texture. In general, it was found that surface roughness might not be the dominate parameter, but the density of nodule boundary in the porous films would affect the electrical property of the electroplating Cu. An increasing extent of the (1 1 1) preferred orientation tends to loosen the nodules and lower the sheet resistance and resistivity of Cu layers. A decrease in the current density and an increase in deposition time tend to produce a Cu layer with (1 1 1) preferred orientation and results in relatively low sheet resistance and resistivity.

原文English
頁(從 - 到)757-762
頁數6
期刊Journal of Materials Science: Materials in Electronics
15
發行號11
DOIs
出版狀態Published - 2004 十一月 1

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Atomic and Molecular Physics, and Optics
  • Condensed Matter Physics
  • Electrical and Electronic Engineering

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