Effects of current density, pulse plating, and additives on the initial stage of gold deposition

K. Lin, R. Weil

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14 引文 斯高帕斯(Scopus)

摘要

The effects of current density, some pulse-plating variables, and addition agents on the initial structure of gold epitaxially electrodeposited oh silver and copper substrates were investigated. The current density was found to have little effect on the structure. Additions of arsenic, nylon, and melamine inhibited coverage of the substrate. High pulse frequencies and larger duty cycles tended to improve substrate coverage.

原文English
頁(從 - 到)690-692
頁數3
期刊Journal of the Electrochemical Society
133
發行號4
DOIs
出版狀態Published - 1986 四月

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Renewable Energy, Sustainability and the Environment
  • Surfaces, Coatings and Films
  • Electrochemistry
  • Materials Chemistry

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