Effects of current density, pulse plating, and additives on the initial stage of gold deposition

K. Lin, R. Weil

研究成果: Article同行評審

14 引文 斯高帕斯(Scopus)

指紋 深入研究「Effects of current density, pulse plating, and additives on the initial stage of gold deposition」主題。共同形成了獨特的指紋。

Chemical Compounds

Engineering & Materials Science