Effects of electrical current on microstructure and interface properties of Sn-Ag-Cu/Ag photovoltaic ribbons

Kuan Jen Chen, Fei Yi Hung, Truan Sheng Lui, Li Hui Chen, Dai Wen Qiu, Ta Lung Chou

研究成果: Article

3 引文 斯高帕斯(Scopus)

摘要

This study presents an electrical current testing that is based on the Sn-xAg-0.5Cu (x = 1, 3 mass%) photovoltaic (PV) ribbon, and investigates the growth mechanism of the intermetallic compounds (IMCs). The microstructure of both alloy solders contains the eutectic region (β-Sn+Cu6Sn 5+Ag3Sn) and the base phases (β-Sn). The eutectic phases in the Sn-3Ag-0.5Cu (SAC305) alloy presented a continuous distribution, and its amount was higher. After soldering, the Cu6Sn5 and Ag3Sn IMCs were found at the interfaces, and their morphologies were dominated by Ag contents in the Sn-Ag-Cu (SAC) solder. The whole interfacial characteristics of IMCs were affected after biasing for 40 h. The growth behavior of these IMCs was controlled by the bias-induced thermal diffusion mechanism and the evolution of IMC morphology was dominated by the growth dynamics. The IMCs, formed at the interfaces (SAC/Cu, SAC/Ag), dominated the series resistance of the PV ribbon.

原文English
頁(從 - 到)1155-1159
頁數5
期刊Materials Transactions
54
發行號7
DOIs
出版狀態Published - 2013 七月 26

    指紋

All Science Journal Classification (ASJC) codes

  • Materials Science(all)
  • Condensed Matter Physics
  • Mechanics of Materials
  • Mechanical Engineering

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