摘要
The effects of Ga addition on the wetting properties and tensile properties of Sn-8.55Zn-0.5Ag-xGa lead-free solder alloys are investigated. The x content of the solders investigated is 0~3 wt%. The results indicate that Ga exhibits a prominent influence on the wetting behavior as well as the mechanical properties of the solders. The wetting properties are improved remarkably with the increase of the Ga content in the Sn-8.55Zn-0.5Ag lead-free solder. The tensile test shows that 1~2% Ga alloys have significant improvement in UTS, when compared with that of the binary Sn-Zn and Sn-Zn-0.5Ag alloys. As for Sn-Zn-0.5Ag, the addition of Ga elements has provided a good wetting force, wetting time and tensile strength.
| 原文 | English |
|---|---|
| 頁（從 - 到） | 621-627 |
| 頁數 | 7 |
| 期刊 | Indian Journal of Engineering and Materials Sciences |
| 卷 | 21 |
| 發行號 | 6 |
| 出版狀態 | Published - 2014 12月 1 |
All Science Journal Classification (ASJC) codes
- 一般材料科學
- 一般工程