Effects of gallium on wettability, microstructures and mechanical properties of the Sn-Zn-Ag-Ga and Sn-Zn-Ag-Al-Ga solder alloys

Kang I. Chen, Kwang Lung Lin

研究成果: Conference contribution

10 引文 斯高帕斯(Scopus)

摘要

The microstructures and mechanical properties of Sn-8.55Zn-0.5 Ag-0.45Al -yGa (wt %) and wetting behavior of Sn-8.55Zn-0.5Ag-yGa (wt %) lead-free solders were investigated. The Ga content, y, of the solders investigated were 0.5 wt % ∼3.0 wt %. The results indicate that Ga plays an important role not only in the structure and wetting behavior, but also in the mechanical properties. The mechanical properties and DSC behavior were compared with that of 63Sn-37Pb and Sn-9Zn solders. Ga lowers the melting point of the Sn-8.55Zn-0.5Ag-0.45Al-yGa solders. The Sn-8.55Zn-0.5Ag-0.45Al-0.5Ga solders exhibit greater strength and better ductility than the 63Sn-37Pb.

原文English
主出版物標題Proceedings of the 4th International Symposium on Electronic Materials and Packaging, EMAP 2002
發行者Institute of Electrical and Electronics Engineers Inc.
頁面49-54
頁數6
ISBN(電子)078037682X, 9780780376823
DOIs
出版狀態Published - 2002 一月 1
事件4th International Symposium on Electronic Materials and Packaging, EMAP 2002 - Kaohsiung, Taiwan
持續時間: 2002 十二月 42002 十二月 6

出版系列

名字Proceedings of the 4th International Symposium on Electronic Materials and Packaging, EMAP 2002

Other

Other4th International Symposium on Electronic Materials and Packaging, EMAP 2002
國家Taiwan
城市Kaohsiung
期間02-12-0402-12-06

    指紋

All Science Journal Classification (ASJC) codes

  • Electrical and Electronic Engineering
  • Materials Science(all)

引用此

Chen, K. I., & Lin, K. L. (2002). Effects of gallium on wettability, microstructures and mechanical properties of the Sn-Zn-Ag-Ga and Sn-Zn-Ag-Al-Ga solder alloys. 於 Proceedings of the 4th International Symposium on Electronic Materials and Packaging, EMAP 2002 (頁 49-54). [1188812] (Proceedings of the 4th International Symposium on Electronic Materials and Packaging, EMAP 2002). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/EMAP.2002.1188812