Effects of internal heat generation on optimal shape design for packaging containing heating objects using inverse heat transfer method

Chin-Hsiang Cheng, Hung Hsiang Lin, Win Aung

研究成果: Conference contribution

摘要

The present study is concerned with the determination of the optimal shape for packages containing heating substrates or objects. An design optimization tool has been developed based on an inverse heat transfer (IHT) approach, which incorporates a direct problem solver, a grid generator, a sensitivity analyzer, and the conjugate gradient method. Shape design that features an isothermal outer surface or meets other specified thermal requirements is predicted by the approach. In this study, the effects of internal heat generation on optimal shapes of the packagings have been evaluated. Several practical cases with various imbedded heating objects and thermal boundary conditions are studied to demonstrate the performance of the approach.

原文English
主出版物標題Advances in Electronic Packaging; Thermal Manegement Reliability
頁面1057-1063
頁數7
出版狀態Published - 2001 十二月 1
事件Pacific Rim/International , Intersociety Electronic Packaging Technical/Business Conference and Exhibition - Kauai, Hi, United States
持續時間: 2001 七月 82001 七月 13

出版系列

名字Advances in Electronic Packaging
2

Other

OtherPacific Rim/International , Intersociety Electronic Packaging Technical/Business Conference and Exhibition
國家/地區United States
城市Kauai, Hi
期間01-07-0801-07-13

All Science Journal Classification (ASJC) codes

  • 工程 (全部)
  • 電氣與電子工程

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