Effects of oxidizing agent and hydrodynamic condition on copper dissolution in chemical mechanical polishing electrolytes

Jui Chin Chen, Shiou Ru Lin, Wen Ta Tsai

研究成果: Article同行評審

22 引文 斯高帕斯(Scopus)

摘要

The effects of H 2 O 2 and Fe(NO 3 ) 3 on the electrochemical behavior, dissolution rate and surface characteristics of Cu in static and under rotating conditions were investigated. Rotating cylinder electrodes were used for potentiodynamic polarization curves measurements in 0.0078M citric acid (CA) base electrolytes with various concentration of H 2 O 2 (0-12vol.%) and Fe(NO 3 ) 3 (0-0.2M). The rotating speed was varied in the range of 0-3000rpm. The dissolution rates of Cu were determined using Tafel extrapolation, inductively coupled plasma-mass spectrometry (ICP) solution analysis, and weight loss measurements, depending on the electrolytes involved. The surfaces of specimens after immersion in the electrolytes for a certain period of time were characterized with Auger electron spectroscopy (AES), X-ray photo-electron spectroscopy (XPS), and atomic force microscopy (AFM). The experimental results showed that H 2 O 2 with sufficient concentration could promote passivation of Cu in the CA base electrolyte, which was confirmed by AES and XPS. The addition of Fe(NO 3 ) 3 into the CA base electrolyte did not cause the formation of passive film and its presence enhanced the dissolution rate of Cu. In both H 2 O 2 and Fe(NO 3 ) 3 containing electrolyte, the dissolution rates increased with increasing electrode rotating speed.

原文English
頁(從 - 到)80-90
頁數11
期刊Applied Surface Science
233
發行號1-4
DOIs
出版狀態Published - 2004 六月 30

All Science Journal Classification (ASJC) codes

  • 化學 (全部)
  • 凝聚態物理學
  • 物理與天文學 (全部)
  • 表面和介面
  • 表面、塗料和薄膜

指紋

深入研究「Effects of oxidizing agent and hydrodynamic condition on copper dissolution in chemical mechanical polishing electrolytes」主題。共同形成了獨特的指紋。

引用此