EFFECTS OF PLATING VARIABLES AND ADDITIVES ON THE INITIAL STAGE OF GOLD ELECTRODEPOSITION.

Kwang-Lung Lin, R. Weil, K. Desai

研究成果: Conference article同行評審

摘要

Previously the effect of the type of substrate, silver and copper and that of an addition agent, arsenic on the structure which developed when gold was epitaxially electrodeposited in a sulfite plating solution was investigated. It was found that on silver substrates, the deposit tended to spread extensively laterally while on copper discrete three-dimensional crystallites formed. The additive was said to have reduced the crystallite size. The study was extended to determine the effects of current density, the pulse plating variables and two other foreign substances added to the electrolyte. Two foreign substances, nylon and melamine, were selected which had a detrimental effect on gold deposited from sulfite plating solution. Nylon causes the deposit to be rough and spongy. Melamine contamination results in spotty plating.

原文English
頁(從 - 到)348-349
頁數2
期刊Electrochemical Society Extended Abstracts
85-2
出版狀態Published - 1985 十二月 1

All Science Journal Classification (ASJC) codes

  • 工程 (全部)

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